Analytical Services

ATDF provides complete analytical and microscopy services to solve your material analysis and process characterization problems. With extensive experience supporting an advanced R&D fab, ATDF Analytical Services has the right tools and know-how to analyze conventional and cutting-edge materials for semiconductor process characterization.

Key Features

• Cutting edge equipment
• One stop shop for all analytical requirements
• Competitive Pricing
• Extensive in House experience covering the latest materials, techniques and structures
• Analytical services available for all wafer sizes
• Services customized to your exact requirements
• Rapid response and turnaround times

The following cutting edge services are available:

• Scanning Electron Microscopy (SEM) - High resolution SEM imaging with BSE and EDS capabilities
• Auger - Film, particle and defect composition
• Secondary Ion Mass Spectrometry (SIMS) - Ultra shallow dopant profiling/ backside depth profiling
• Atomic Force Microscopy (AFM) - Surface roughness measurements
• Transmission Electron Microscopy (TEM) - Gate oxide and thin film metrology
• Scanning TEM / Holography / Diffraction - Crystal identification, dopant profiling, chemical profiling
• Vapor Phase Decomposition Inductively Coupled Plasma Mass Spectrometry (VPD-ICP-MS) - Whole wafer trace metal contamination analysis
  
• Total Reflection X-ray Fluorescence (TXRF) - Non-destructive trace metal contamination analysis
• Bevel Edge Analysis Tool - measurement of contamination on the wafer edge
• Electrical Characterization Lab

For more information on SVTC Services, click here